ASSET - Solutions Beyond ICT

From the press release:

A new white paper from ASSET® InterTech explains why test coverage from intrusive, probe-based in-circuit testers with their bed-of-nails fixtures is diminishing. The paper also describes software-based non-intrusive methodologies that test from the inside out and eliminate the need to physically probe chips and circuit boards during prototype board bring-up, volume manufacturing and troubleshooting in the field.

The new white paper is titled “Solving the problem of diminishing test coverage from in-circuit test (ICT)” by Adam Ley, chief technologist of non-intrusive board test for ASSET.